Product Details for Material from Tdk - C2012C0G1H153J085AA - TDK 0805 C 15nF Ceramic Multilayer Capacitor, 50 V dc C0G Dielectric ±5% SMD

C2012C0G1H153J085AA Tdk TDK 0805 C 15nF Ceramic Multilayer Capacitor, 50 V dc C0G Dielectric ±5% SMD

Part Nnumber
C2012C0G1H153J085AA
Description
TDK 0805 C 15nF Ceramic Multilayer Capacitor, 50 V dc C0G Dielectric ±5% SMD
Producer
Tdk
Basic price
0,18 EUR

The product with part number C2012C0G1H153J085AA (TDK 0805 C 15nF Ceramic Multilayer Capacitor, 50 V dc C0G Dielectric ±5% SMD) is from company Tdk and distributed with basic unit price 0,18 EUR. Minimal order quantity is 1 pc.


Capacitance15nF Depth1.25mm DielectricC0G Dimensions2 x 1.25 x 0.85mm Height0.85mm Length2mm Maximum Operating Temperature+125°C Minimum Operating Temperature-55°C Mounting TypeSurface Mount Package/Case0805 SeriesC Temperature Coefficient±30ppm/°C Tolerance±5% Tolerance Minus-5% Tolerance Plus+5% Voltage50 V dc Product Details TDK C type 0805 series High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layersA monolithic structure ensures superior mechanical strength and reliabilityLow ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical valuesLow self-heating and high ripple resistance due to low ESRCommercial Grade for general applications includingGeneral electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets 0805 Range Nickel barrier terminations covered with a layer of plated Tin (NiSn),Applications include mobile phones, video and tuner designs,COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials,X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials,Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.


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